My Conscientia

Wednesday, 4 September 2013

5 Easy Steps to Set up Wireless Ad-Hoc Network in Windows 8 using Command Prompt…!!!

Why require Wireless Ad-Hoc Network:

If you have two or more computers equipped with wireless adapters (Wi-Fi cards), and you don’t have a Wireless Router to share the network, then it is possible to easily connect them in a network by setting up a so-called "ad hoc" network, that is, a computer-to-computer network, without using an access point.
If one of the computers on the ad hoc network has an internet connection, it is possible to share it with the other computers on the network, like in the case of a traditional local network.

My following post will help you to easily setup a Wireless Ad-Hoc Network using command prompt.

PROCEDURE:
Before setup, please be ensure that your system network interface must be capable of supporting hosted networks. It’s always advisable to update your network adapter to the latest drivers before doing this.

Launch an elevated command prompt under Windows 8 (with administrator privileges).
Run the following command to verify that your network interface supports virtualization:

netsh wlan show drivers

After entering the above command, if the “Hosted Network Supported = Yes” (See the highlighted part in the above image), that means everything is OK. Otherwise, you have to upgrade your system hardware/ software.

Now to setup the Ad-Hoc network, run the following command,

netsh wlan set hostednetwork mode= allow ssid=<enter_network_name> key=<enter_password>

Now your Ad-Hoc network is created, to start it run the following command,

netsh wlan start hostednetwork

Now your is ready, just do one thing. If it’s not already enabled, you need to allow Internet Connection Sharing (ICS) for your currently-active internet connection. Simply head over to Network & Sharing Center, and in the properties for the current internet connection, enable ICS. Make sure to select the ad hoc connection under Home networking connection.

Now your all your setup is complete & fully functional. You can now connect any device to the internet using the ad hoc wireless network with internet connection sharing that you just created on your Windows 8 PC and enjoy the wireless network service.

Cucumber and its Health Benefits:

Cucumber and cross section (Photo credit: Wikipedia)

There are so many Fruits which can do magical things for our health. Cucumber is one among them. Cucumber is beneficial for both interior and exterior parts of our body. Cucumber is great in salads and fresh juice. Cucumber does a great job in refreshing and hydrating the body especially since it contains 95% water.

Some Benefits Of Cucumber:

Cucumber has antioxidant and anti-inflammatory properties.
Cucumber is rich in Vitamin B. Apart from that, it contains about 95% water which indeed helps in hydrating the body. If the body gets good hydration, it can eliminate toxins, which is good for kidneys and liver as well.
It is good to eat as a snacks because Cucumber with its skin have most of the amount of daily vitamins that a body requires.
Cucumber has the ability to fight with cancers like Ovarian Cancer, Breast Cancer, Uterine Cancer.
A hormone found in Cucumber can help the Pancreas to produce insulin, which is a big issue with Diabetic patients.
Cucumber can also help in reducing the Cholesterol levels.
As cucumber is rich in potassium,fiber and magnesium, it can help in regulating the blood pressure(BP).
Cucumber contains a vitamin called Silica which can give strength to connective tissues such as joints that indeed helps in problems like arthritis pain, joint pain, gout, brittle nails etc.
Some other benefit includes : good for digestion, weight loss and bad breath, beneficial for pyorrhea,natural remedy for treating tapeworms.
Cucumber is not only useful for health,rather we can use it in home for cleaning foggy mirrors.

References:
http://www.naturalnews.com
http://www.exhibithealth.com

Tuesday, 3 September 2013

Wi-Vi : A New System to Track Moving Human Behind Walls…!!!

INTRODUCTION:

Wi-Fi signals are typically information carriers between a transmitter and a receiver.But now these Wi-Fi signals can also extend our senses, enabling us to see moving objects through walls and behind closed doors. In particular, we can use such signals to identify the number of people in a closed room and their relative locations.We can also identify simple gestures made behind a wall, and combine a sequence of gestures to communicate messages to a wireless receiver without carrying any transmitting device.
Wi-Vi stands for “Wi-Fi” and “Vision”. Its a new promising new technology that enables seeing through walls using Wi-Fi signals. It allows us to track moving humans through walls and behind closed doors. Wi-Vi relies on capturing the reflections of its own transmitted signals off moving objects behind a wall in order to track them. Wi-Vi's operation does not require access to any device on the other side of the wall.

This promising technology is the contribution of MIT Prof. Dina Katabi and graduate student Fadel Adib. This pair announced Wi-Vi, a demonstration of a technology that uses WiFi to allow a viewer to "see" a person moving behind a wall. (Wi-Vi stands for "WiFi" and "vision.")
Previous work demonstrated that the subtle reflections of wireless inter signals bouncing off a human could be used to track that person's movements, but those previous experiments either required that a wireless router was already in the room of the person being tracked, or "a whole truck just to carry the radio," said Katabi.
The new device uses the same wireless antenna as is found in a cell phone or laptop and could in theory one day be embedded in a phone.

WHAT WI-VI CAN DO:

Detect the Number of Moving Humans in a Closed Room Wi-Vi allows us to detect presence of a moving human in a closed room. It can also can determine with high accuracy up to 3 moving objects.
Determine the Relative Locations of Moving Humans
The technology can also determine the motion of different persons in a closed room. It can answer questions such as: Is the person moving towards the device or away from it? What is the angle of motion of a person inside a closed room relative to the location of WiVi?
Enable Communication through a Wall without Carrying a Wireless Device
Wi-Vi is both a transmitter and a receiver. A human can communicate with it using simple gestures without carrying or wearing any wireless device.
Identify Simple Gestures from Behind a WallWi-Vi can detect very simple gestures made through a wall, making it the first through-wall gesture-based interface.

APRICOT : A Wonder Fruit

The fruit, kernels, oil and flowers of the apricot have been used in medicine from a decade. Apricots are small, golden orange fruits, with soft skin and flesh, not too juicy but sweet in taste. Apricot contains Vitamin A,C, Fiber, Potassium, Tryptophan.

An apricot and its cross section (Photo credit: Wikipedia)

A famous medicine in China known as 'Apricot Gold' was made from the kernels of trees which grew in certain areas. This medicine was reputed for its powers to prolong life. The Chinese also believed that apricots reacted sympathetically to women's ailments. The apricot flowers, therefore, formed a common ingredient in their cosmetics.

The kernel, which yields oil similar to that of the almond, has been widely used for their sedative, antispasmodic (which gives relief to strained muscles) and demulcent or soothing properties. They are useful in the healing of wounds, in expelling worms and as a general tonic.

BENEFITS:

Protects heart and eyes. Apricot tones up the eyes, stomach, liver, heart and nerves by supplying vitamins and minerals.
Protects your eyesight as apricot is rich in Vitamin A and Carotenes.
Apricot can be useful for treating Asthma.
Helps in bone related problem as it is rich in Vitamin C.
Helps in digestion as well as constipation. Apricots have an alkaline reaction in the system. They aid digestion, if consumed before a meal. Patients suffering from chronic constipation can get benefit by use of apricots .
The apricot is an excellent food remedy for anaemia on account of it high content of iron. The small but essential amount of copper in the fruit makes iron available to the body.
Apricots could also increase the production of haemoglobin in our body.
Fresh juice of apricots, mixed with glucose or honey, is a very cooling drink during fevers. It quenches thirst and eliminates the waste products from the body.
Fresh juice of apricot leaves is useful for treating skin diseases. It can be applied with beneficial results in scabies, eczema, sun-burn and itching of the skin due to cold exposure.
Apricot seed contains high content of amygdalin, is a source of vitamin B17 and utilized in alternative medicine for cancer therapy.
Apricot and apricot products help to maintain body fluid balance by normalizing blood pressure and heart function.
The amazing nutritional and medicinal properties of apricot fruits and kernels can go on and on. It is not surprising that dried apricots being compact, balanced and rich in minerals.

Monday, 2 September 2013

3D–INTEGRATED CIRCUIT : The New Emerging Technology in CHIP Design Industry

INTRODUCTION:

Over the decades, Moore's law, which states that over the history of computing hardware, the number of transistors on integrated circuits doubles approximately every two years, has continued mapping into reality since from it was stated. This has been proven accurate in the Semiconductor Industry. The capabilities of many digital electronic devices are strongly linked to Moore's law: processing speed, memory capacity, sensors and even the number and size of pixels in digital cameras. Also the capabilities of all these devices are improving exponentially as well.

In the past basically System on Chip (SoC) components allowed the integration of many functionalities. But the rapid downsizing as per Moore’s law CMOS technology reaches limits and SoC solutions request commercially high production volume. This implies that the packaging density of an IC has continued to increase day by day, thereby the performance per IC has also continued to increase with ease; therefore the methods to develop solutions to produce IC other than on a 2D structure were not sought.

The improvements in the on-chip wire delay and in the maximum no. of inputs and outputs per chip have not been able to keep up with transistor performance growth, and it has become progressively harder to hide the discrepancy. In addition, the complexities of lithography beyond the 32 nm node threaten the traditional performance and cost scaling patterns. In contrast with these conventional 2D structure, 3D IC offers a new pattern that builds multiple layers of active devices stacked over each other.

Now days the 3D ICs have recently getting attention among the researchers and IC designers as an cutting-edge technology to overcome the issues related to interconnect delay and power limitations. The evolution of 3D IC technology shows promising possibilities for the future of chip design with some tremendous advantages: Lower Power Consumption, Short Delays, Less interconnects Length, Capacitance, Resistance, Low Foot Print, Improved System Performance.

HISTORY:

The first person who had given the concept about 3D Integrated Circuits was Prof. Jim Early of Bell Labs. In 1960, he had stated about the stacking components in a Cubic Arrangements.

In 2004, Intel presented a 3D version of the Pentium 4 CPU. It was manufactured with two dies using face-to-face stacking, which thereby enabled a dense via structure. Backside TSVs are used for I/O and power supply.

The Teraflops Research Chip introduced in 2007 by Intel is an experimental 80-core design with stacked memory. Due to the high demand for memory bandwidth, a traditional I/O approach would consume 10 to 25 W.

The academic implementation of 3D processor was first introduced by Prof. Eby Friedman & his students in the year 2008 at University of Rochester.

Two 3D-IC-based multi-core designs using GlobalFoundries' 130 nm process and Tezzazon's FaStack technology were presented and demonstrated in ISSCC 2012.

One of the major Semiconductor industry giant Synopsys, introduced a 3D-IC solution in the first half of 2012.

MANUFACTURING TECHNOLOGIES:
Following are the technologies used for building 3D ICs.

Monolithic: in this process electronic components and their interconnects are placed on a single layer of Semiconductor Wafer, which is then diced in to 3D ICs. In this process there is no need for thinning, aligning, bonding or through-Silicon Vias as there is only one substrate.

Wafer on Wafer: in this process, electronic components are built on two or more Semiconductor Wafers, which are then aligned, bonded and diced in to 3D ICs.

Die on Wafer: in this process, electronic components are built on two wafers. One wafer is diced, then the singulated dice are aligned & bonded on to the die sites of second wafer.

Die on Die: in this process, electronic components are built on multiple dice, which are then aligned and bonded.

BENEFITS OF 3D ICs:

Lower Footprints: by using the design of 3D ICs, it creates the ability to reduce the footprints of an existing IC. It implies more functionality can be implemented in to small space.

Lower Power Consumption: as per UC Davis's William Dally's 2006 presentation, placing a signal on a chip can actually contribute to a 10x to 100x reduction in power by the use of 3D IC.

Short Interconnect Delays: by using the 3-dimensional design the length between the interconnects are reduced on an average. It thereby reduces the delays between the interconnects.

Bandwidth: the 3-dimensional design allows large no of vertical vias between the layers. This allows construction of wide bandwidth buses between functional blocks of different layers.

Cost: by partitioning a large chip on to multiple smaller dies with 3D stacking, reduces the number of interconnects, thereby results in high yield and reduces the fabrication cost.

CHALLENGES:

Thermal Flux: stacking multiple active dies directly on top of each other leads to high concentration of heat, which cannot be easily dissipated.

Increased risk of defects: in 3D design new series of interconnects are need to implemented, which require thorough testing and verification because the failure of a single plane can result to the failure of entire IC.

Lack of design tools: implementation of 3D ICs require highly sophisticated design technologies and new CAD tools.

Lack of Standards: several options have been explored are some of them are currently under research but yet a de-facto for 3D IC development has yet to be introduced.

CONCLUSION:

Though 3D ICs have several benefits of its predecessors but first careful consideration needs to be taken in getting the proper solution for the above said challenges that are inherent in adding a 3-dimension to a circuit design.
If high design standards and high automated design tools are properly implemented then in future it will bring tremendous result in Semiconductor industry with high productivity and improved performance.

A Spicy and Tangy Condiment : Green Chilli Pepper Pickle

INGREDIENTS:

1/2 Kg Chilli Pepper(Green One)
150 gram Fennel Seeds(Saunf)
50 gram Fenugreek Seeds(Methi)
50 gram Mustard Seeds(Rai/Sarson)
20 gram Cumin Seeds(Zeera)
3 tbsp Turmeric Powder(Haldi)
Salt to taste(approx. 300 gram)
200 ml Mustard Oil
15 Big size/20 small size Lemons(squeeze them to get juice)

PROCEDURE:

Wash the Green Chilli Pepper and strain the water.
Roast all the spices(Fennel Seeds,Fenugreek Seeds,Mustard Seeds, Cumin Seeds) individually in a Pan.
Mix all the roasted spices once they get cool and Grind them to form a good powder.
Add salt, turmeric powder, little oil(approx. 1tsp), 2 tsp lemon juice to the above masala mixture and mix them well.
Now make small cuts in the middle of each capsicum(don’t cut them till the end) .
Stuff the masala mixture into each capsicum equally and set aside for about 2 hour in a big bowl.
After 2 hours put the lemon juice in the stuffed capsicum and mix them well.
Keep them in a dark room and keep stirring at a regular interval for 10-12 hours.
Next dry them under the sun for full day, keep stirring at a regular interval. At the end of the day add oil to it and mix well.
At last dry them under the sun for 4-5 days.
Green Chilli Pepper Pickle is ready. It can be preserved in an air tight glass Jar. and can be used for 6 to 8 months.

Sunday, 1 September 2013

PAPAD ROLL- Weekend Evening Snacks Special…!!!

INGREDIENTS:

8-10 pcs Papad of Any Brand
4 Big Size Boiled Potato
1 cup finely grated Paneer
1/2 cup Sweet corn
1/2 cup finely chopped Capsicum
1/2 cup finely chopped Tomato
1 medium size finely chopped Onion
8-10 pcs finely chopped Cashew nuts
15-20 pcs of Raisins
1/2 cup finely chopped Coriander Leaves
1 tbs Ginger-Garlic Paste
3-4 finely chopped Green Chilies
2 tsp Red Chilly Powder
1/2 tsp Black Salt
1 tsp Lemon Juice
1/2 tsp Turmeric Powder
1/2 tsp Cumin Powder
1/2 tsp Garam Masala
1/2 tsp Chat Masala
1 pinch of Carom Seeds(Ajwain)
1/2 tsp Fennel Seeds
1/2 tsp Cumin Seeds
Salt to Taste
Oil For Frying

PROCEDURE:

Peel the Boiled Potato and Mash them well.
Take 2 tbs Oil in a Skillet in medium Flame and add the Cumin and Fennel Seeds to it once the oil gets hot.
Once the seeds pop, add all the Chopped Vegetables, Cashew Nuts, Raisins and fry for 2-3 minutes.
Then add the Ginger-Garlic Paste and fry it for 1-2 minutes.
Then add the mashed Potato along with all the Masala, Black Salt, Lemon Juice, Carom Seeds, Red Chilly Powder, Turmeric Powder and Salt to Taste.
Mix them all well. After that add the finely chopped Coriander Leaves to it. Now your stuffing for the Papad Roll is ready.
Now take a Papad piece and dip it in water. Take it out immediately.
Now spread the grated Paneer over the Papad.
Put a portion of the cooked stuffing on a side of the Papad and Make roll of it.
Sealed both the end of the roll properly, so that the stuffing doesn’t come out.
In this way make the rolls of the Papad Pieces.
Now take Oil in a Skillet in medium Flame for deep frying.
Once the oil gets hot, add the 2-3 rolls to it and keep frying carefully till the rolls get Golden Brown Color.
Now take them out & put them on an Oil-absorbent Paper for the absorption of extra oil.
Now your Papad Roll is ready. Serve them hot with Tomato Ketchup or Chutney.

Thethri: A Delicious Crispy and Spicy Snack from Western Odisha (Orissa)

INGRIDIENTS:

1.5 cup semolina (suji/rawa)
1 cup Rice flour
½ tsp spoon Ajwain (Carom Seeds)
Salt to Taste(approx. ½ tbs)
Oil to Fry
For Masala:

1 tsp Cumin (zeera)
½ inch Ginger
4 slices Garlic
2 green Chillies (Can be added more for spicy)

PROCEDURE:

Prepare the Masala first by grinding with the mentioned ingredients.
Boil 2 cup of water in a Pan.
Mix the masala once water becomes Luke warm.
Also mix the Ajwain and salt.
Then add semolina (suji/rawa) slowly and stir it continuously.
Make sure the semolina (suji/rawa) does not sit on the bottom.
When semolina (suji/rawa) starts thickening, mix the rice flour slowly and keep stirring.
After few minutes it will become thick. At that point touch it in wet hand to check the stickiness of the mixture.
If you feel it is not sticky and little bit hard then switch off the flame.
Keep it aside till it becomes little cool.
Then mash it with hand by putting little oil in your hand and make dough of it.
Then make small balls (approx. ½ cm in diameter) out of it and roll each ball in hand to give cylindrical shape but keep the ends little pointed.
Put oil in a Pan in medium flame for deep frying.
Once the Oil gets hot, put them in oil for deep fry.
Keep frying in low flame until it becomes golden colour and crisp.
Now take them out & put them on an Oil-absorbent Paper for the absorption of extra oil.
Keep them to be cool .
Thethri is ready to serve. Thethri can be used for more than 15 days by keeping in an air tight jar.